Micas Networks 51.2T Co-Packaged Optics

Launched in volume production on March 17, 2025, this industry-first 51.2T CPO switch, developed with Broadcom, is a game-changer for AI data centers. By integrating optics with the switch chip, it overcomes copper interconnect limitations, delivering high bandwidth and low latency for AI/ML workloads. It supports large-scale GPU clusters and LLMs, ensuring scalability and energy efficiency.

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Technical Specifications

Form Factor

2U rack-mount Ethernet switch

Processor

Broadcom ASIC with integrated optical engine (no GPU included)

Network Interfaces

64x 800GbE ports (optical)

Performance Features  

  • 51.2 Tbps full duplex bandwidth  
  • Co-packaged optics (CPO) integrates optical engine with switch chip, eliminating pluggable optics  
  • Reduces power consumption and improves efficiency for AI data centers  
  • Supports 400GbE/800GbE with low-latency RoCEv2 for GPU cluster connectivity

Management  

  • SONiC network operating system for open networking flexibility  
  • Advanced management for real-time AI workload optimization

Power Supply  

  • High-efficiency power supplies  
  • Redundant and hot-swappable power and cooling systems  
  • Manufactured in Micas’ Malaysia factory with clean room technology

Best for

Hyperscalers, cloud data centers, and OEMs for AI-driven applications

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